220 Products

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-7711/21C: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-A-610G: Acceptabilité des Assemblages Électroniques

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IPC-A-610G:Acceptabilité des Assemblages Électroniques

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences des...

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-J-STD-001G: Les exigences relatives au brasage d’assemblages électroniques et électriques

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-1754: Material Declaration Standard for Aerospace and Defense

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IPC-1753-WAM1: Laboratory Report Standard

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates