Standards: Other Standards: Design

103 Products

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IPC-7091: Design and Assembly Process Implementation of 3D Components



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IPC-7091: Design and Assembly Process Implementation of 3D Components



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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards



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IPC-7525B-RU: Руководство по конструированию трафаретов



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IPC-2513A: Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description



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7090-FAM: Packages for PCBs and Assemblies



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PtdEleFAM: Printed Electronics Family



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IPC-2220-FAM: Design Standards for Printed Boards



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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata



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4562A-CN: 印制板用金属箔



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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用



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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范



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T-50M-CN(D)1: 电子电路互连与封装术语及定义



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T-50H-CN: 电子电路互连与封装术语及定义



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2221A-CH: Generic Standard on Printed Board Design



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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés



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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé



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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides



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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie



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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE



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IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards



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7351A-DE: SUPERSEDED BY 7351B-DE



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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile



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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits