Standards: Other Standards: Design

99 Products

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-1754: Material Declaration Standard for Aerospace and Defense

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

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IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics

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IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics - English

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IPC-2224: Sectional Standard of Design of PWBs for PC Cards - English

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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7090-FAM: Packages for PCBs and Assemblies

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PtdEleFAM: Printed Electronics Family

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IPC-2220-FAM: Design Standards for Printed Boards

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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4562A-CN: 印制板用金属箔

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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T-50M-CN(D)1: 电子电路互连与封装术语及定义

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T-50H-CN: 电子电路互连与封装术语及定义