Standards: Other Standards: Design

70 Products

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

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IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics - English

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IPC-2224: Sectional Standard of Design of PWBs for PC Cards - English

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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4562A-CN: 印制板用金属箔

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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T-50M-CN(D)1: 电子电路互连与封装术语及定义

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T-50H-CN: 电子电路互连与封装术语及定义

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2221A-CH: Generic Standard on Printed Board Design

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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE

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IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC-7525B-DE: Designrichtlinie für Druckschablonen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile