Standards: Other Standards: Design

99 Products

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IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

Member: $67.00

Nonmember: $129.00

7351A: SUPERSEDED BY 7351B

Member: $84.00

Nonmember: $168.00

IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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Nonmember: $93.00

IPC-A-311: Process Controls for Phototool Generation and Use

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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

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Nonmember: $116.00

7351: SUPERSEDED BY 7351A

Member: $49.00

Nonmember: $93.00

7095A(D)1: Design and Assembly Process Implementation for BGAs

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Nonmember: $168.00

IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-2615: Printed Board Dimensions and Tolerances

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2315: Design Guide for High Density Interconnects & Microvias

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IPC-2252: Design Guide for RF/Microwave Circuit Boards

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Nonmember: $131.00

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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2221A: Generic Standard on Printed Board Design

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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

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1756: Manufacturing Process Data Management

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-2291: Design Guideline for Printed Electronics

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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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Nonmember: $168.00

IPC-7095C: Design and Assembly Process Implementation for BGAs