Standards: Other Standards: Design

99 Products

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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink



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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards



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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)



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IPC-T-50J: SUPERSEDED BY T-50K



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IPC-7525B: Stencil Design Guidelines



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ASSEMBLYISSUE-03-11: HDI Assembly Related Issues



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IPC-2291: Design Guideline for Printed Electronics



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IPC-7093-DE: Einführung des Design- und Verarbeitungsprozess von Bottom Termination Components



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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures



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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring



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T-50M-CN: 电子电路互连与封装术语及定义



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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides



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IPC-9691A-CN: IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试(电化学迁移测试)用户指南



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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范



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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés



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IPC-9691A-DE: Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.25, Leitfähiges Anodisches Faserwachstum, Widerstandstest X-Y-Achse (Conductive...



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IPC-T-50K-DE: Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits