Standards: Other Standards: Lead Free

13 Products

Narrowed By: 2013

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



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IPC-T-50K-DE: Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen



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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards



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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires



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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires



Member: $80.00

Nonmember: $160.00

IPC-7095C-CN: BGA设计与组装工艺的实施



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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Nonmember: $148.00

IPC-7095C-CN: BGA设计与组装工艺的实施



Member: $75.00

Nonmember: $148.00

IPC-7095C: Design and Assembly Process Implementation for BGAs