Standards: Other Standards: Lead Free

38 Products

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IPC-7801: 再流焊炉工艺控制标准 - Chinese



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IPC-7801: 再流焊炉工艺控制标准 - Chinese



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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés



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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques



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IPC-7095C-CN: BGA设计与组装工艺的实施



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J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite



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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求



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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试



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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级



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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1



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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1



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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices



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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1



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IPC-7801: Reflow Oven Process Control Standard



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology