Standards: Other Standards: Lead Free

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...



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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English



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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline



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IPC-A-610G: Acceptability of Electronic Assemblies



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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-A-610G: Acceptability of Electronic Assemblies



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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-4550-FAM: Plating Specifications



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IPC-6010-FAM: Printed Board Performance Specifications



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7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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PtdEleFAM: Printed Electronics Family



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SolMatFAM: Solder Materials Family



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IPC-2220-FAM: Design Standards for Printed Boards



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J-STD-001D: Rev D superseded by Rev E



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J-006A: SUPERSEDED BY J-STD-006B



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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IPC-A-610D WAM1: Acceptability of Electronic Assemblies



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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments



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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components



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7095A(D)1: Design and Assembly Process Implementation for BGAs



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1756: Manufacturing Process Data Management



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IPC-A-610E: Acceptability of Electronic Assemblies