Standards: PCB Fabrication: Acceptance

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IPC-A-600J-FR: Acceptabilité des Circuits Imprimés



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IPC-9691A-DE: Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.25, Leitfähiges Anodisches Faserwachstum, Widerstandstest X-Y-Achse (Conductive...



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-A-600H-DE: Abnahmekriterien für Leiterplatten



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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards



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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards



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IPC-9241: Guidelines for Microsection Preparation



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-A-600J: Acceptability of Printed Boards



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...



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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards



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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards



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J-STD-003C WAM1: Solderability Tests for Printed Boards



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6013C: Qualification and Performance Specification for Flexible Printed Boards