Standards: PCB Fabrication: Flex

35 Products

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards



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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards



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Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards



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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards



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IPC-4550-FAM: Plating Specifications



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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards



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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits



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J-STD-048: Notification Standard for Product Discontinuance



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-4204A WAM1-CN: 挠性印制电路用挠性覆金属箔介质材料



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6013C: Qualification and Performance Specification for Flexible Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



Member: $75.00

Nonmember: $148.00

IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-2220-FAM: Design Standards for Printed Boards