Standards: PCB Fabrication: Materials

78 Products

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IPC-1601-CN: 印制板操作和贮存指南



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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten



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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards



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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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J-004A: SUPERSEDED BY J-STD-004B



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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards



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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat



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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications



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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards



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4104: Specification for High Density Interconnect (HDI) and Microvia Materials



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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile



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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-1753: Laboratory Report Standard



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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications



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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard