Standards: PCB Fabrication: Processes/Fabrication

98 Products

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten



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J-004A: SUPERSEDED BY J-STD-004B



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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards



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IPC-DR-572A: Drilling Guidelines for Printed Boards



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IPC-2316: Design Guide for Embedded Passive Device Printed Boards



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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards



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A-52: Cleanliness and Residue Evaluation Test Board - Single User Download



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IPC-4761: Design Guide for Protection of Printed Board Via Structures



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)



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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials



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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards