143 Products

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A-52: Cleanliness and Residue Evaluation Test Board - Single User Download

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-8497-1: Cleaning Methods and Contamination Assessment for Optical Assembly

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-6011: Generic Performance Specification for Printed Boards

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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4104: Specification for High Density Interconnect (HDI) and Microvia Materials

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IPC-2252: Design Guide for RF/Microwave Circuit Boards

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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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2221A: Generic Standard on Printed Board Design

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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile

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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation