Standards: PCB Fabrication: Embedded

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IPC-6010-FAM: Printed Board Performance Specifications



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7090-FAM: Packages for PCBs and Assemblies



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4562A-CN(D)1: 印制板用金属箔



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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件



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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件



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IPC-2316: Design Guide for Embedded Passive Device Printed Boards



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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards



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J-STD-048: Notification Standard for Product Discontinuance



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices



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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink



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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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Nonmember: $89.00

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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Nonmember: $3,975.00

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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Nonmember: $125.00

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry