Standards: PCB Fabrication: Embedded

11 Products

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-9691A-CN: IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试(电化学迁移测试)用户指南



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IPC-9691A-DE: Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.25, Leitfähiges Anodisches Faserwachstum, Widerstandstest X-Y-Achse (Conductive...