Standards: PCB Fabrication: Flex

26 Products

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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-A-600H-PL: Kryteria Dopuszczenia Płyt Drukowanych



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards



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IPC-4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-A-600J-CN: 印制板的可接受性



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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards



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IPC-A-600H-RU: Критерии приемки печатных плат



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IPC-A600H-JP: プリント板の受け入れ



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IPC-4204A WAM1-CN: 挠性印制电路用挠性覆金属箔介质材料



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IPC-4202A-CN: 挠性印制电路用挠性基底介质



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IPC-4553A-CN: 印制板浸银规范



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IPC-2223C-CN: 挠性印制板设计分标准



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4562A-CN: 印制板用金属箔



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IPC-A-600H-FR: Acceptabilité des Circuits Imprimés



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IPC-A-600J-FR: Acceptabilité des Circuits Imprimés



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IPC-2223C-DE: Design-Richtlinie für flexible Leiterplatten



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-A-600H-DE: Abnahmekriterien für Leiterplatten



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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-A-600J: Acceptability of Printed Boards