Standards: PCB Fabrication: HDI

104 Products

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IPC-4550-FAM: Plating Specifications



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4562A-CN: 印制板用金属箔



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IPC-6012D-CN:刚性印制板的鉴定及性能规范



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2221A-CH: Generic Standard on Printed Board Design



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos



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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-DR-572A: Drilling Guidelines for Printed Boards



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IPC-6016: Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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4104: Specification for High Density Interconnect (HDI) and Microvia Materials



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IPC-2226: Sectional Design Standard for High Density Interconnect (HDI) Boards



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2221A: Generic Standard on Printed Board Design