Standards: PCB Fabrication: HDI

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards



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IPC-4550-FAM: Plating Specifications



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards



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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards



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IPC-6012D-CN: 刚性印制板的鉴定及性能规范



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-6012C-CN: 刚性印制板的鉴定及性能规范



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits