Standards: PCB Fabrication: HDI

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4562A-CN: 印制板用金属箔



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IPC-6012D-CN: 刚性印制板的鉴定及性能规范



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2221A-CH: Generic Standard on Printed Board Design



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten



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IPC-DR-572A: Drilling Guidelines for Printed Boards



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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4104: Specification for High Density Interconnect (HDI) and Microvia Materials



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2221A: Generic Standard on Printed Board Design



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1



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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards



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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits