Standards: PCB Fabrication: High-Speed/High-Frequency

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IPC-4550-FAM: Plating Specifications



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4562A-CN(D)1: 印制板用金属箔



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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范



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T-50H-CN(D)1: 电子电路互连与封装术语及定义



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2221A-CH: Generic Standard on Printed Board Design - Chinese Language



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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos



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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos



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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-DR-572A: Drilling Guidelines for Printed Boards



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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IPC-2252: Design Guide for RF/Microwave Circuit Boards



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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit



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2221A: Generic Standard on Printed Board Design



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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...



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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...



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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...



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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards



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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards