Standards: PCB Fabrication: Materials

94 Products

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IPC-4550-FAM: Plating Specifications



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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SolMatFAM: Solder Materials Family



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J-STD-004A-JP: Requirements for Soldering Fluxes - Japanese Language



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4562A-CN(D)1: 印制板用金属箔



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T-50H-CN(D)1: 电子电路互连与封装术语及定义



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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QF-143(D)1: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards



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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards - Single User...



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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J-004A(D)1: SUPERSEDED BY J-STD-004B



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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards



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A-142(D)1: Specification for Finished Fabric Woven from Aramid for Printed Boards



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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat



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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications



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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards



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4104(D)1: Specification for High Density Interconnect (HDI) and Microvia Materials



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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile



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1751A(D)F: Generic Requirements for Declaration Process Management - includes Amendment 1



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry