Standards: PCB Fabrication: Materials

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IPC/JEDEC J-STD-609A Errata Information



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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium



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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes



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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards



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IPC-1753-WAM 1: Laboratory Report Standard - English



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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard



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IPC-4591A: Requirements for Printed Electronics Functional Conductive Materials



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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications



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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards



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J-STD-004A-JP: Requirements for Soldering Fluxes



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4562A-CN: 印制板用金属箔



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T-50H-CN: 电子电路互连与封装术语及定义



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards



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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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J-004A: SUPERSEDED BY J-STD-004B



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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards



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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards



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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement



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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat



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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications



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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards



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4104: Specification for High Density Interconnect (HDI) and Microvia Materials