Standards: PCB Fabrication: Materials

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IPC-7095C: Design and Assembly Process Implementation for BGAs



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC/JEDEC J-STD-609A Errata Information



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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes



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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products



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IPC-1601-CN: 印制板操作和贮存指南



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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten



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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1



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T-50H-CN: 电子电路互连与封装术语及定义



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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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4562A-CN: 印制板用金属箔



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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink



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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards



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J-STD-004A-JP: Requirements for Soldering Fluxes



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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline



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IPC-9691A-CN: IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试(电化学迁移测试)用户指南



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IPC-9691A-DE: Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.25, Leitfähiges Anodisches Faserwachstum, Widerstandstest X-Y-Achse (Conductive...



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IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile



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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards



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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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J-004A: SUPERSEDED BY J-STD-004B



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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards