Standards: PCB Fabrication: Processes/Fabrication

104 Products

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IPC-7091: Design and Assembly Process Implementation of 3D Components



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IPC-7091: Design and Assembly Process Implementation of 3D Components



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IPC-6012DS-CN: 刚性印制板的鉴定及性能规范航天和军事航空电子应用补充标准



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IPC-4550-FAM: Plating Specifications



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IPC-6010-FAM: Printed Board Performance Specifications



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7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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SolMatFAM: Solder Materials Family



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J-STD-004A-JP: Requirements for Soldering Fluxes



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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范



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4562A-CN: 印制板用金属箔



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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件



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IPC-6012D-CN: 刚性印制板的鉴定及性能规范



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IPC-9252A-CN: 未组装印制板电气测试要求



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T-50H-CN: 电子电路互连与封装术语及定义



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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IPC-1601-CN: 印制板操作和贮存指南



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten