Standards: PCB Fabrication: Processes/Fabrication

98 Products

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IPC-9631-DE: Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.27, Thermischer Stress, Simulation des Konvektions-Reflow-Löten



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IPC-1601-CN: 印制板操作和贮存指南



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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten



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IPC-9151D: Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database



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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten



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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards



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T-50H-CN: 电子电路互连与封装术语及定义



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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices



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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium



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IPC-9252A-CN: 未组装印制板电气测试要求



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IPC-9252A-CN: 未组装印制板电气测试要求



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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4562A-CN: 印制板用金属箔



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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink



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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards



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J-STD-004A-JP: Requirements for Soldering Fluxes



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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline



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IPC-SM-840D: Qualification and Performance



Specification of Permanent Solder Mask



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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)



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J-004A: SUPERSEDED BY J-STD-004B



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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards



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IPC-DR-572A: Drilling Guidelines for Printed Boards



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IPC-2316: Design Guide for Embedded Passive Device Printed Boards



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A-52: Cleanliness and Residue Evaluation Test Board - Single User Download