Standards: PCB Fabrication: Processes/Fabrication

95 Products

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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件



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IPC-6012C-CN: 刚性印制板的鉴定及性能规范



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards



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IPC-9121: Troubleshooting for PCB Fabrication Processes



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IPC-4204A WAM1-CN: 挠性印制电路用挠性覆金属箔介质材料



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IPC-4412B-CN: 印制板用处理“E”玻璃纤维布规范



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IPC-9252A-CN: 未组装印制板电气测试要求



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-9631-DE: Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.27, Thermischer Stress, Simulation des Konvektions-Reflow-Löten



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards



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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards



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IPC-9241: Guidelines for Microsection Preparation



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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards



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1601A: Printed Board Handling and Storage Guidelines



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...



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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards



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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards



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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



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IPC-4101D: SUPERSEDED BY: 4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards