Standards: PCB Fabrication: Quality/Test

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IPC-A600H-Errata: IPC-A-600H Errata Information



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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium



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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes



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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1



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IPC-9691B: IPC-TM-650 测试方法2.6.25耐导电阳极丝(CAF)及其他内部电化学迁移(ECM)测试用户指南



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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English



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IPC-4550-FAM: Plating Specifications



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IPC-6010-FAM: Printed Board Performance Specifications



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7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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SolMatFAM: Solder Materials Family



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IPC-7711/21A-PL:Rework and Repair Guide



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J-STD-004A-JP: Requirements for Soldering Fluxes



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4562A-CN: 印制板用金属箔



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IPC-9691A-CN: IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试(电化学迁移测试)用户指南



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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范



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IPC-A-600J-CN: 印制板的可接受性



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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件



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IPC-6012D-CN: 刚性印制板的鉴定及性能规范



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IPC-9252A-CN: 未组装印制板电气测试要求



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T-50H-CN: 电子电路互连与封装术语及定义



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos