Standards: PCB Fabrication: Quality/Test

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos



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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...



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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos



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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...



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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides



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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen



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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten



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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten



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IPC-OI-645: Standard for Visual Optical Inspection Aids



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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J-004A: SUPERSEDED BY J-STD-004B



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IPC-DR-572A: Drilling Guidelines for Printed Boards



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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards



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IPC-9199: Statistical Process Control (SPC) Quality Rating



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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)



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IPC-6011: Generic Performance Specification for Printed Boards



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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards



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IPC-4761: Design Guide for Protection of Printed Board Via Structures



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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation



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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-9641: High Temperature Printed Board Flatness Guideline



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards