This document summarizes the IPC position on the subject of “halogen-free” materials for the electronics industry. Its initial release was developed over a period of three years and this revision is also the culmination of another three years of work by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics including, but not limited to, copper-clad laminates and prepregs, resin coated copper foils, flexible materials and solder masks. This document reflects the state of the information and technology as of May 2007. 33 pages. Released August 2007.