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ADVELECPK-IRVINE1-11: Manufacturing opportunities and challenges for printing of advanced electronic packaging

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Manufacturing opportunities and challenges for printing of advanced electronic packaging Mark Poliks, director of research and development, Endicott Interconnect Technologies, discusses the goals of weight reduction, reliability and cost reduction for printed electronics at the IPC Conference on Printed Electronics in January 2011. The author discusses materials, processing and some markets this technology may impact as well as the challenges it presents. He also covers the equipment used for processing at his facility. This presentation includes the synchronized slides and audio from the live presentation. 34 minutes. Released 2011.

Product ID: AEP-MTG-0-D-0-EN-11