IPC-4203B: Cover and Bonding Material for Flexible Printed Circuitry
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 126.96.36.199) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
Single-Device DRM-Protected Document
This document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. IF you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.
For information about IPC standards with DRM protection, visit www.ipc.org/drm.
Product ID: 4203-STD-0-D-0-EN-B