IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

Member: $47.00

Nonmember: $93.00

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

Number of Pages: 19
Product ID: 4563-STD-0-D-0-EN-0