IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline Member: $47.00 Nonmember: $93.00 Language: English Format: Download Published Date: 2/11/2008View table of contentsBack Member: $47.00 Nonmember: $93.00 Quantity -+ Add to Cart Product Description This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias ... Product Details Number of Pages: 19Product ID: 4563-STD-0-D-0-EN-0Product DescriptionProduct DetailsBackThis guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.BackNumber of Pages: 19Product ID: 4563-STD-0-D-0-EN-0See MoreSee Less Single User LicenseTraining Media Permissible Uses
