SINGLE DEVICE DOWNLOAD
Release Date
SKU: 7095-STD-0-D-W1-EN-D
Note:
This is a non-printable product.
Nonmember price: $183.00
Member price: $110.00
Your price: $183.00
MULTI-DEVICE DOWNLOAD
Release Date
SKU: 7095-STD-0-MDL-W1-EN-D
Note:
This is a non-printable product.
Nonmember price: $282.00
Member price: $169.00
Your price: $282.00
Seats
HARD COPY
Release Date
SKU: 7095-STD-0-P-W1-EN-D
Out of Stock
Will ship when available
Nonmember price: $215.00
Member price: $129.00
Your price: $215.00

Product Details

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

Published Date
ISBN
978-1-61193-486-1
Pages
208
DoD Adopted
No
ANSI Approved
No