IPC-7525B: Stencil Design Guidelines
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
Product ID: 7525-STD-0-D-0-EN-B