IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

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Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.

Number of Pages: 79
Product ID: 9501-STD-0-D-0-EN-0