This document addresses preconditioning of non-IC components used in electronic assembly. Will the components work with your process? The goal of these manufacturing process simulations is to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials. 23 pages. Released August 1998.