IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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Nonmember: $93.00

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.

Number of Pages: 96
Product ID: J027-STD-0-D-0-EN-0