IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.
Number of Pages: 96
Product ID: J027-STD-0-D-0-EN-0
Product ID: J027-STD-0-D-0-EN-0