IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
Multiple-Device License (MDL), Digital Rights Management (DRM) - Protected Document. The MDL DRM product can be purchased starting with a 12 device license and any quantity larger than that. A 10% discount is applied to any quantity of 20 and more when purchased on the same order. Users of this MDL document will only be able to open it on the number of devices specific to the product order. (Example: If you placed an order for a MDL of 12 then you would be able to open the document on 12 devices) For information about IPC standards with DRM protection, visit www.ipc.org/mdl
- Chinese - Download - Single-User License: IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用
- English - Download - Single-User License: IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
- Spanish - Download - Single-User License: IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso