IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
Release Date: 5/13/2020
Product ID: J033-STD-0-MDL-0-EN-D
- Chinese - Download - Single-User License: IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用
- English - Download - Single-User License: IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
- Spanish - Download - Single-User License: IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso