IPC-PCB Technology Trends 2018
PCB Technology Trends 2018 is based on data from 74 companies (52 electronics OEMs and 22 PCB fabricators) worldwide. PCB Technology Trends 2018 presents data on the current state (2018) of PCB fabrication and OEM's PCB requirements and their use of emerging technologies. Predictions from both industry segments indicate how these measurements and requirements are expected to change by 2023. The data are segmented by two regions (North America and Europe; Asia and Africa) and two types of products (mobile and installed). Topics covered include board properties (thickness, layer count, density, line width and spacing, via diameters, aspect ratios, I/O pitch, via design, blind and buried vias, and thermal properties), materials (rigid, flexible, stretchable, metal core, loss characteristics and surface finishes), special structures (embedded componets, chip packages), printed electronics (including 3D printing and e-textiles), compliance and technical challenges, and general trends. 213 pages. Published in January 2019.
Multiple-Device DRM-Protected Document
This document has Multiple-Device DRM-Protected Document (DRM) protection. This document can be opened on up to 10 devices. To open on more than 10 devices, you must increase the quantity of your order. Example: To open on up to 20 devices, increase your order quantity from 1 to 2.
For information about IPC documents with DRM protection, visit www.ipc.org/drm.