IPC-Study of Quality Benchmarks for Electronics Assembly 2018
Study of Quality Benchmarks for Electronics Assembly 2018 is a global survey-based study covering production data, assembly attributes, yields, defect rates (DPMO), test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products can use this report to compare their performance to industry averages. Medians, and percentile data are also reported. The survey sample includes 63 contract electronics manufacturers and OEMs in worldwide with total sales revenue ranging from under $10 million to more than $1 billion. Aggregate data are segmented by company size tier, region and type of production, including rigid PCBs, flexible circuits, end products, mechanical assembly, cable and harness, and discrete wiring terminals and connectors. Released July 2018.
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Product ID: BMK-MR-0-D-E-EN-18