J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1
This is the Japanese language version of J-STD-005.
Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.
Product ID: J005-STD-0-D-0-JP-0