J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - AM1
The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the IPC-J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the IPC J-STD-006C standard.
Release Date: 12/5/2019
Product ID: J006-STD-0-P-A1-EN-C