J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. It outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC-9503. Developed by ECA, IPC and JEDEC. 12 pages. Released August 2008.
Product ID: J075-STD-0-D-0-EN-0
- Spanish - Download - Single-User License: IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble
- Chinese - Download - Single-User License: J-STD-075-CN: 组装工艺中非IC电子元器件的分级
- German - Download - Single-User License: J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes