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MILMKT12-11-TECRDMP: Technology Roadmap for Aerospace & Defense Electronics Assembly Industry

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"Technology Roadmap for Aerospace & Defense Electronics Assembly Industry" was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market by Bill Murphy, Fellow Product Integration, Lockheed Martin, at Washington D.C, in December 2011. The author describes present and future challenges to the electronics assembly industry. Budget decreases and requirements for quicker and more reliable products are impacting product development.Current challenge trends include circuit and power density and supply chain. Future challenges include embedded actives, passives and optical wave guides.30 minutes. Released 2012.

Product ID: MIL-RM-0-D-ADEF-EN-11