PCB Technology Trends 2014 (Global License)
Based on data from 158 PCB fabricators and assembly companies worldwide, this report presents data on the current state (2014) and the industry’s predictions for the data by 2019, collected for the 2015 IPC Technology Roadmap. The data are segmented by five applications: computer and telecommunications, consumer electronics, industrial and automotive, medical, and military and aerospace. Topics covered include clock speed, heat dissipation, operation cycles, environmental operating range, product life expectancy, lamination cycles, materials, board area, board thickness, layer count, embedded components, printed-in-place features, line width and spacing, via diameters, aspect ratios, surface-mount lands, I/O pitch, test density, recyclable content and component size, as well as numbers of vias, solder joints, and discrete, area array, peripheral leaded, peripheral leadless and through-hole components. Additional data that is not segmented by application covers voltage levels and optical channels. 173 pages. Published May 2015.
Product ID: TT-MR-0-DG-P-EN-14