TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download

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This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.

Number of Pages: 38
Product ID: 1-TR-0-D-0-EN-0