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TW0412-MAGMORPH: Y-12 Lead-Free Solder Technologies

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This paper was presented at the IPC Tin Whiskers Conference, April 18, 2012, by Russell Hallman, Senior Engineer at Y-12 National Security Complex. The author examines the properties of non-magnetic material in magnetic fields as applied to solders and plating and possible effects on tin whisker growth. He shows that control of microstructure can control performance of surface wetting and crystal growth by distribution of chemistry in the mechanical joint. He then describes some areas for future study and expected benefits.

This presentation includes the synchronized slides and audio from the original presentation. 31 minutes. Released 2012.

Number of Pages: 27
Product ID: TW-PRO-0-D-MAG-0-12