Current Revision
IPC-9701B

IPC-9701B: Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

Published Date
ISBN
978-1-63816-072-4
Pages
24
DoD Adopted
No
ANSI Approved
No