IPC-771/21C-AM1-English: Rework, Modification and Repair of Electronic Assemblies - Multi Device License
40 Products
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Member: $130.00 Nonmember: $260.00
IPC-A-600K: Acceptability of Printed Boards - Multi Device License
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IPC-6012ES: Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid...
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2019 Wage Rate & Salary Study for the North American Electronics Assembly Industry
Member: $84.00 Nonmember: $168.00
IPC-6012E: Qualification and Performance Specification for Rigid Printed Boards - Multi Device License
Member: $130.00 Nonmember: $260.00
IPC/WHMA-A-620D: Requirements and Acceptance for Cable and Wire Harness Assemblies
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2019 Analysis & Forecast for the North American EMS Industry
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IPC-Study of Quality Benchmarks for Electronics Assembly 2019
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IPC-PCB Technology Trends 2018
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World PCB Production Report for the Year 2017
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IPC-2019 Annual Report on the North American PCB Industry
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IPC-2018 Annual Report - North American PCB Industry
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IPC-Study of Quality Benchmarks for Electronics Assembly 2018
Member: $1,350.00 Nonmember: $2,700.00
2017 Wage Rate & Salary Study for the North American Electronics Assembly Industry
Member: $1,350.00 Nonmember: $2,700.00
IPC-2018 Annual Report and Forecast for the North American EMS Industry
Member: $47.00 Nonmember: $93.00
IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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IPC-J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610G: Acceptability of Electronic Assemblies - Multi Device License
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IPC-A-610G: Aceptabilidad de ensambles electrónico
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IPC-A-610G:Acceptabilité des Assemblages Électroniques
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IPC-A-610G: Abnahmekriterien für elektronische Baugruppen
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IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles
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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards - Multi Device License