38 Products

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IPC-J-STD-001E-RU: Superseded by J-STD-001F-RUТребования к электрическим и электронным сборкам, изготавливаемым с помощью пайки

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

Member: $84.00

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IPC-CH-65B-CN: 印制板及组件清洗指南

Member: $84.00

Nonmember: $168.00

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

Member: $47.00

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IPC-7525B-CN: 模板设计指导

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-7525B-DE: Designrichtlinie für Druckschablonen

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FUTUREELE-IRVINE1-11: Future of Printed Electronics

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EXESUM10-10-TECHPACK: Technology Package

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EXESUM10-10-ECONOMIC: Effects of 2010 global economics on competition in the PCB and electronics manufacturing services...

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MEANPCB-IRVINE-01-11: Printed Electronics: What Does It Mean for the Printed Circuit Board Industry?

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ADVELECPK-IRVINE1-11: Manufacturing opportunities and challenges for printing of advanced electronic packaging

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MILCERT-0915: Trends in Military Certifications: What You Need to Know About the Obvious and the...

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THERMMIL-11-10-CA: Military Electronics Cooling and Thermal Management Issues: Moving Away From COTS

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TINWHISKER-12-10-IL: Tin Whiskers: Heroics or Hysteria - Where is the Middle Ground?

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TINCONFCOAT-12-10-IL: Long Term Investigation of Urethane Coating Against Tin Whisker Growth

Member: $84.00

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

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FLEXFUTURE-MN06-11: Keynote: the Future of Flex: Opportunities and Challenges

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FLEXMAN-MN06-11: Staying Flexible with Manufacturing when the Military is in Flux

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IPC-9850A: Surface Mount Placement Equipment Characterization

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EXESUM10-11-SUPCHAIN: Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and...