J-STD-004B-CN: 修订本 1 助焊剂要求
31 Products
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SPVC-TAL1: Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots
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J-STD-006B-CN WAM1 & 2: SUPERSEDED BY J-STD-006C-CN
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J-STD-006B WAM1 & 2: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid...
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IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
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T-50H-CN: 电子电路互连与封装术语及定义
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IPC-2152: Standard for Determining Current Carrying Capacity in Printed Board Design
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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
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IPC-4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards
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IPC-A-610DC-Telecom Addendum
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COMPTRACE-0609: What You Can Do About Component Traceability
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IPC-7711/21B-SP: Retrabajo, Modificación y Reparación de Ensamble Electrónicos
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IPC-4553A-CN: 印制板浸银规范
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IPC-4553A: Specification for Immersion Silver Plating for Printed Boards
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WP-009: A Summary of Tin Whisker Research References
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P-KD0508: Abilities and Gaps: Image Transfer Technologies in PWB Fabrication
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IPC-1752A-Errata
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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability