IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范
93 Products
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Member: $47.00 Nonmember: $93.00
IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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IPC-9708-CN: 鉴定印制板组件焊盘坑裂的测试方法
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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides
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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards
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9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering
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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards
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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...
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P-MICRO: PCB Multi-Issue Microsection Wall Poster
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IPC-4101C-DE: Spezifikation für Basismaterialien für starre Leiterplatten und Multilayerleiterplatten
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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles
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A-600H-SE: Acceptanskrav för mönsterkort
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ENVSYM0710: Proceedings from the IPC Conference It’s Not Easy Being Green: UNDERSTANDING PROLIFERATING CHEMICAL AND...
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ENVSYM0511: It's Not Easy Being Green: Roadmap to Compliance Proceedings
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IPC-4101C-CN: 刚性及多层印制板⽤基材规范
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IPC-1601-CN: 印制板操作和贮存指南
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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten
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IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded
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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen
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IPC-A600H-Errata: IPC-A-600H Errata Information
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IPC/JEDEC-J-STD-033B.1-RU: бращение, упаковка, транспортировка и использование компонентов для поверхностного монтажа, чувствительных к влаге при пайке...
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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie
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IPC-7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard